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Key Job Accountabilities:
• Lead and manage semiconductor backend manufacturing operations across Backgrind, Laser Mark, , Laser groove, Wafer Saw, AOI, and Tape & Reel processes to achieve safety, quality, delivery, cost, and productivity targets.
• Drive operational excellence through continuous improvement initiatives focused on yield enhancement, cycle time reduction, equipment utilization, and cost optimization.
• Lead multiple production shifts through supervisors and engineers, ensuring effective manpower planning, workforce development, and operational discipline.
• Manage customer escalations, production risks, and quality excursions, ensuring timely containment, root cause analysis, and corrective actions.
• Partner with Process, Equipment, Quality, Planning, and Maintenance teams to resolve complex manufacturing issues and improve process robustness.
• Monitor and drive key manufacturing KPIs including OEE, yield, UPH, cycle time, on-time delivery, scrap, and labor productivity.
• Support New Product Introduction (NPI), process transfers, and manufacturing readiness activities to meet customer and business requirements.
• Champion Lean Manufacturing, Six Sigma, automation, and Industry 4.0 initiatives to improve factory performance and scalability.
• Ensure compliance with quality systems, customer requirements, EHS standards, and audit expectations.
• Develop and execute manufacturing strategies, organizational capability, and succession plans to support long-term business growth.
Required Experience and Qualifications:
Job ID: 149400203
Skills:
Capacity Management, Automation, Digitalization, Production Planning, Supply chain integration, Capital expenditure management, Budgeting, Manufacturing strategy execution, Quality Management, Regulatory Compliance, Lean Six Sigma
Skills:
LEAN Manufacturing principles, testing environment, capital tool assembly
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