Responsibilities
- Execute Level 1 and Level 2 equipment troubleshooting, recovery, and critical component replacements on ASML lithography platforms.
- Plan and perform preventive maintenance (PM) activities, forecast spare parts usage, and optimize inventory to minimize equipment downtime.
- Monitor machine performance, optimize tool capacity and efficiency, and drive repair and maintenance (R&M) cost-reduction initiatives.
- Review daily operational metrics, including SPC, FDC, Alarm 3, RTM, EMAP, and Daily Rework, to maintain process stability.
- Mentor junior engineers and assistant engineers while establishing standard procedures, PM documentation, and Best Known Methods (BKMs).
- Support new equipment installation, facility hook-ups, vendor start-ups, calibration, and production acceptance.
- Ensure fab safety and 6S compliance, adhere to ISO standards, and participate in fab Emergency Response Team (ERT) activities.
Requirements
- Bachelor's degree in Electrical, Electronics, Mechanical Engineering, or a related discipline.
- Hands-on experience with ASML PAS / XT lithography platforms (operation, maintenance, troubleshooting, and optimization).
- Minimum 3 years of semiconductor manufacturing experience for Senior Engineer level (1-3 years for Engineer level extensive experience will be considered for Principal Engineer position).
- Proficiency in semiconductor data monitoring systems (SPC, FDC) and failure analysis methodologies.
- Willingness to support rotating/swing shifts and emergency response duties as needed.
Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to [Confidential Information]
EA License No: 13C6305
Reg. No.: R1985234 (GOH HOOI MING)
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