Job description
Job Responsibilities:
. Analyze SPC charts using SPACE apply PR rules, perform proper annotations for SPC OOC troubleshooting, and monitor Cp/Cpk indices.
. Analyze split lots, DOE, ET, and sort yield data using JMP and Klarity ACE.
. Create SPC charts and DCOP modify SLDB using PROMIS (Si-View).
. Upload, verify, and ensure recipe compliance using RMS.
. Follow up on SPSR, MRB, 8D, TECN, and spec updates (ECN) provide guidance to junior engineers.
. Set up and troubleshoot recipes/job files across all metrology tools within the module.
. Analyze engineering data to identify chronic process issues and lead improvement programs establish CAS/procedures and coordinate crossdepartment resolution.
. Collaborate with Equipment and Manufacturing teams to meet module objectives and drive uptime and OEE targets. . Lead small cross-functional teams to resolve yield excursions and drive yield improvement.
. Initiate and support CIP programs to optimize process window, yield, cost, and productivity improve process capability.
. Resolve complex technical and yield-related issues within the module.
. Support cross-fab benchmarking to adopt best practices across fabs.
. Conduct self-audits and update specifications/documentation to meet TS16949 quality standards.
Requirements:
. Degree in Electrical / Electronics / Microelectronics / Chemical Process / Chemistry / Physics / Material Sciences / Mechanical
. Min 3 years of relevant work experience in Thin Film CMP Process
. An excellent team player with good interpersonal, communication and written skills
. Strong logical thinking capability and good analytical skill
. Highly committed with good ownership and accountability
. Able to adapt in a fast-paced environment and work under pressure Proficient in MS Office Application
