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Micron's vision is to accelerate intelligence to enrich life for all. As a global leader in memory and storage solutions, we are at the forefront of innovation, driving technological advancements that accelerate progress across industries. Our mission is to lead with integrity, innovation, and excellence, empowering our team members to craft the future of memory technology.
We are looking for a driven candidate for a night shift engineer position in Yield Enhancement (YE) lab under Technology Development (TD) at Micron's Singapore site. You will focus on Transmission Electron Microscopy (TEM) analysis and TEM sample preparation using Focused Ion Beam (FIB) system and other methods including micro-cleaving, polishing, ion etching etc. In addition, your growth opportunities include operating state-of-the-art TEM for device analysis and further developing your knowledge of electron microscopy, semiconductor device physics and processing and various characterization techniques. Come join a work environment where you will work with Technology Development groups to develop new processes and novel methods to expedite new part type development and improve yield. Successful candidates for this position will be placed at corresponding Engineer level based on previous experience and education.
Key Responsibilities:
Perform daily FIB and TEM operations to support new technology development at Micron from wafer receiving, wafer management, preparing equipment ready for operation to sample completion.
Prepare high quality TEM samples using FIB and connect with customers to obtain the required information for sample preparation.
Innovate new FIB techniques or embrace sophisticated FIB techniques to meet customer's special needs.
Develop or embrace solutions to improve the efficiency of sample preparation.
Provide detailed pass down to the people in next shift to make smooth shift transition.
Use approved AI-enabled tools to optimize the existing Lab procedures and maintain the lab environment within the scope of safety requirement.
Follow responsible AI, data-security, and quality-control expectations when handling technical information, images, tool logs, and internal communications.
Qualifications:
B.S. degree in Materials Science, Physics, or related field.
Comfortable working permanent night shift.
Strong background in materials science, physics or chemistry is required.
Support occasional overtime and emergency response when required.
Skilled experience and proven knowledge in FIB and TEM operation are preferred.
Self-motivated, ability to work independently and hardworking in learning new technology and knowledge.
Be a phenomenal teammate to work with other TEM engineers and processing groups to advance the technology development.
Experience in creative problem solving and innovative solutions.
Strong interpersonal skills (written, verbal and presentation).
At Micron, your personal well-being and professional growth are our priorities. We offer a comprehensive benefits package designed to support your health, provide peace of mind, and help you plan for the future. Our benefits include:
Competitive medical, dental, and vision plans.
Income protection through disability and paid family leave programs.
Generous paid time off and holidays.
Opportunities for career advancement and professional development.
Employee stock purchase plan (ESPP).
For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Job ID: 153353031

Skills:
Microsoft Office, BEOL integration, Data Analysis, AI-enabled productivity tools, troubleshoot problem solving, digital technologies, Semiconductor Device Physics, DRAM operations, Presentation, Layout, probe yield, digital collaboration platforms, AI data analytics, wafer fabrication process flows, parametric electrical test, advanced packaging, Reporting
Skills:
Microsoft Office, Data Analysis, BEOL integration, AI-enabled productivity tools, Semiconductor Device Physics, digital technologies, DRAM operations, Layout, probe yield, digital collaboration platforms, AI data analytics, wafer fabrication process flows, parametric electrical test, advanced packaging
Skills:
manufacturing processes , risk assessments, Root Cause Analysis, Spc, Statistical Tools, precision optical assembly, 8D, tooling development, Process Validation, polishing, Lean Six Sigma methodologies, Doe, fiber optic termination
Skills:
Data Analytics, Spc, Chemical Mechanical Planarization, process development, Doe, Troubleshooting, Fmea, Polishing process engineering