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Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we're more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
Job's mission
As a Senior / Process Engineer in Advanced Packaging, you will bring your research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM's mission to enable the chips that power today's most advanced technologies.
What you will be working on
What we are looking for
What sets you apart
Apply today to be part of what's next.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what's possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.
Job ID: 148481349
Skills:
software systems, surface preparation technologies, electro mechanical equipment, Xrd, ECP, DOE-based approaches, ellipsometry, materials characterization, thin-film deposition, pecvd, ald, TEM, Sem, PVD
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