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Micron's Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology.
Key Responsibilities
Develop and optimize unit processes to meet yield and quality targets for advanced NAND devices
Evaluate innovative process and equipment solutions for early experimentation and process margin improvement
Collaborate with Singapore-based Diffusion manufacturing teams to identify and prioritize key technology challenges
Integrate and troubleshoot processes within cross-functional teams focused on yield and quality enhancement
Partner with Boise TD Films teams to align future device requirements with process capabilities
Identify disruptive process technologies early and define viable implementation paths with global TD and manufacturing teams
Conduct fundamental research, hardware evaluations, and novel process testing to support intellectual property generation
Design and execute experiments to expand process margins and validate manufacturability of next-node solutions
Lead cross-functional initiatives to simplify processes and implement improvements
Embed best-known manufacturing practices into early-stage development of new nodes
Develop and apply advanced process monitoring and control methodologies.
Serve as a technical expert, contributing to process, equipment, and procedural improvements
Lead multidisciplinary projects across teams, sites, and suppliers focused on quality, yield, cost, and productivity
Advise management on significant technical issues and drive innovation through patents and technical publications
Maintain strict adherence to Micron's Intellectual Property protection policies
Engage continuously with global TD partners and suppliers to push for breakthrough solutions
Own and manage module-level business processes
Requirements
Bachelor/Masters in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics with minimum 5 years of relevant experience or PhD in Materials Science, Electrical/Electronics, Chemical, Microelectronic Engineering, Physics
Strong understanding of:
- Flow dynamics, thermodynamics, and physical phenomena in deposition
- Precursor depletion effects in 3D structures and mitigation strategies
- Interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM)
- Integration and structural constraints in film deposition processes
- Memory process flows, especially for planar and vertical NAND
Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE)
Excellent communication skills for both in-person and remote interactions
Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment
Job ID: 145234067