Senior Electrochemical Plating Process Engineer (APM), IME

About the Role:

We are seeking a highly experienced and driven Senior Electrochemical Plating Process Engineer to join our advanced packaging and semiconductor process development team. The ideal candidate will bring deep expertise in BEOL ECP processes, including Cu RDL, Cu pillar, TSV, and UBM plating, as well as strong capabilities in process control, equipment qualification, and yield improvement.

Key Responsibilities:

• Lead development and optimization of ECP processes for advanced packaging applications (e.g., Cu/Ni/Au plating, SnAg bump/solder plating).
• Drive process control and SPC for BEOL PVD and ECP processes, including Ti/Cu seed layers and barrier films.
• Manage equipment procurement, qualification, and supplier sourcing for plating chemicals and consumables.
• Support integration and yield improvement for SVP builds such as WLP, FOWLP, and C2W.
• Conduct DOE and troubleshooting for process enhancement and defect reduction.
• Collaborate cross-functionally with QA, integration, and equipment teams to ensure robust process performance.
• Champion continuous improvement initiatives including cost reduction, productivity enhancement, and system optimization.

Qualifications:

• Master's Degree in Physics, Materials Science, Chemistry, Physics, Material science and equipment or related field.
• Minimum 10 years of experience in semiconductor manufacturing, with strong focus on ECP processes.
• Proven track record in process development, SPC, yield improvement, and equipment qualification.
• Strong analytical skills with tools like JMP, Excel, and defect analysis platforms.