Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Main Responsibilities
As the Senior Director of Package Development & Engineering (PDE) at Micron, you will lead and manage the packaging development team, driving high performance products from qualification to high volume manufacturing. You will collaborate with technology development teams, support new product introduction, and drive continuous yield improvement. Your leadership will be key in managing supplier relationships, ensuring compliance, and encouraging a culture of innovation and excellence. You will be responsible across all aspects of People, Technology, Strategy, and Operations within PDE and will collaborate with internal and external stakeholders to build and execute strategies aligned to organizational and business objectives by delivering high performing and cost-effective packaging solutions on time with highest quality and predictable reliability performance.
Other Responsibilities
People Leadership
Recruit and mentor world-class talent
Provide career development and mentoring
Set goals and conduct performance appraisals
Recognize achievements and drive accountability
Develop project management skills within the team
Identify and develop future leaders
Technical Leadership
Set strategic technical objectives aligned with department goals
Provide technical leadership to influence company direction
Identify and develop new proficiencies
Multi-Functional Leadership
Represent Package Development & Engineering across departments
Collaborate with design, development, manufacturing, and quality teams
Develop and drive multi-functional initiatives
Impact and Execution
Ensure quality, cost control, and production efficiency
Manage site-level budget and resources
Ensure alignment with customer needs and expectations
Analyze and recommend long-term impact of new programs
Growth Mindset
Continually build new skills and proficiencies
Seek opportunities to work multi-functionally
Candidate Profile
The ideal candidate will possess a Bachelor's degree or higher in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or a related field, along with a minimum of 15 years of experience in packaging technology development, semiconductor engineering, or manufacturing, including at least 5 years in a leadership role. You should have in-depth knowledge of DRAM/NAND, 3D packaging technologies, chip-package interaction, BEOL, and various bonding techniques. You will demonstrate an ability to inspire change and build consensus with multi-functional teams and senior leadership. Experience engaging with vendors, consortia, universities, foundries, and customers is crucial. Strong communication and presentation skills, coupled with a willingness to travel internationally, will ensure success in this role.
