Semicon R&D Engineer (Thermal Compression Bonding)

Purposeof the Job:

. To lead the development, evaluation, and optimization of advanced ThermalCompression (TC) bonding and chip attach processes and equipment fornext-generation advanced packaging technologies (e.g., chiplet integration,HBM, 2.5D/3D architectures).

. To establish robust bonding recipes, ensure precise co-planarity and alignmentcontrol, and successfully drive TC bonder tools from R&D concept validationto customer/internal qualification.

Job:

. Advanced TC Bonding Process development for CoWoS PKG product family and CPO

. Tool & Hardware Development / Qualification

. Warpage & Co-planarity Control

. Failure Analysis & Reliability Enhancement

. Customer Development & Technology Transfer

. Lead assigned projects

. Yield Improvement & Yield Failure Analysis (FA)

Requirement:

. Bachelor's degree or higher in engineering or science (e.g., Material Science,Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)

. R&D or mass production experience of at least three years in ThermalCompression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes

. Proven experience in driving customer development programs (e.g., JDP, customerqualification, technical evaluations) and managing customer requirements

. Fundamental understanding of advanced semiconductor packaging processes,thermal-mechanical bonding behavior, and warpage control

. Strong skills in experimental design (DoE), failure analysis (FA), andtechnical data reporting

. Ability to prepare technical documents and deliver presentations to internaland external stakeholders

. Proficiency in reading and writing technical documents

AllSuccessful candidates can expect a very competitive remuneration package and acomprehensive range of benefits.

Pleaseemail your resume in a detailed MS Word format to [Confidential Information] stating

1)Current Drawn

2)Expecting Salary

3)Date Available

4)Reason to Leave each job:

Weregret that only shortlisted candidates will be notified

JoyceKoh Ai Leng

PeopleProfilers Pte Ltd

20Cecil St, #08-09, PLUS Building, Singapore 049705

Tel:6950 9737

www.peopleprofilers.com

EALicense Number: 02C4944

EAPersonnel Reg nos R1110618

JobID: JOB-00951