Semicon ETCH Process Senior/ Engineer

Summary

.To lead the development, optimization, and stabilization of plating and etching processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer-specific technical solutions.

Job. Develop and optimize electroplating, seed etching, and PR stripping processes

. Design and improve processes for TSV, RDL, Cu pillar, and micro bump formation

. Evaluate and introduce new materials and equipment for plating/etching process integration

. Conduct pre-production process validation and yield stabilization

. Perform DOE planning and analyze experimental data using statistical tools (e.g., SPC, Minitab, JMP)

. Develop customized processes and provide technical support for customer programs

. Set up equipment and optimize operating conditions in coordination with vendors

. Troubleshoot quality issues across plating and etching processes

. Support development of advanced packaging technologies including 2.5D, fan-out,and SiP

. Supports high-volume semiconductor packaging processes in plating and etching

. Contributes directly to process yield, quality improvement, and customer technical satisfaction

. Drives technical innovation in advanced packaging technologies in alignment with global customer programs

Requirement

. Bachelor's degree or higher in Engineering or Science (e.g., Materials Science,Chemistry, Chemical Engineering, Electronics, Advanced Materials)

. Minimum 3 years of hands-on experience in plating, etching, or stripping processes in semiconductor manufacturing

. Fundamental understanding of advanced semiconductor fabrication and integration processes

. Strong skills in experiment design, statistical data analysis (e.g., SPC, Minitab, JMP), and technical reporting

. Proficiency in preparing technical documentation and delivering presentations

. Basic knowledge of semiconductor process equipment and materials

. Experience in key back-end processes such as TSV, RDL, and micro bump

. Knowledge of advanced packaging technologies including 2.5D, fan-out, and flip-chip

. Familiarity with related processes such as photo, chip attach, and underfill

. Proven experience in joint development projects with global customers

. Hands-on collaboration with material or equipment suppliers for co-evaluation or integration

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please email your resume in a detailed MS Word format to stating

1)Current Drawn

2)Expecting Salary

3)Date Available

4)Reason to Leave each job:

We regret that only shortlisted candidates will be notified

Joyce Koh Ai Leng

People Profilers Pte Ltd

20 Cecil St, #08-09, PLUS Building, Singapore 049705

Tel: 6950 9737

EA License Number: 02C4944

EA Personnel Reg nos R1110618

Job ID: 93R5X694