Job Responsibilities:
- Operate lithography equipment and perform related measurements to support panel UHD advanced packaging development.
- Analyze metrology data for equipment setup and process performance, and make decisions based on SPC and OCAP guidelines.
- Support DOE activities, engineering runs, and process characterization.
- Carry out routine equipment maintenance, respond to machine alarms, and perform recovery actions.
- Operate and take ownership of lithography-related tools.
- Perform tool setup, daily inspections, preventive maintenance (PM), and basic calibration.
- Troubleshoot and resolve common equipment issues.
- Support the installation, qualification, and ramp-up of new tools.
Job Requirements:
- Diploma / ITE / Technical certification in Electrical / Mechanical / Mechatronics Engineering, Materials Science, Semiconductor Manufacturing or related discipline.
- 1-5 years of experience with Lithography tools in semiconductor fab environment or wafer/panel level packaging, coating, exposure, developing, baking, thickness, CD, and overlay measurement tools.
- Basic understanding of semiconductor wafer processing and cleanroom practices
- Basic knowledge of SPC, MSA and inspection process capability
- Experience supporting R&D, pilot line, or NPI (New Product Introduction) is a plus.
We regret that shortlisted candidates will be notified.
Name: Teoh Xue Ling
Registration No.: R22107190
EA License No.: 02C3423
Shirleen Teoh Xue Ling License No.: 02C3423 Personnel Registration No.: R22107190
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