R&D Director - Semiconductor Equipment

Responsibilities

Lead local Hybrid Bonding equipment full-cycle R&D, architecture design, technical breakthrough and iteration.

Connect with local & Southeast Asian OSAT/wafer fabs, match HBM, Chiplet, 3D stacking process demands, deliver technical solutions.

Oversee precision mechanism, nano alignment, motion control, vacuum & temp-pressure control, electrical and software system integration & debugging.

Complete prototype tuning, accuracy optimization, yield improvement and customer acceptance, resolve mass production technical issues.

Manage local R&D team, formulate R&D standards, coordinate local supply chain to realize localized mass production.

Track frontier industry technology, carry out technical pre-research and patent layout to boost business commercialization.

Requirements

Bachelor or above, major in Mechanics, Automation, Microelectronics, Semiconductor Equipment etc., Master preferred.

10+ years semiconductor packaging equipment R&D experience, 5+ years Hybrid Bonder complete machine development & mass production experience.

Master nano-level alignment, bonding temp-pressure control, vacuum system design, familiar with advanced packaging process

Familiar with local semiconductor industry resources is preferred.

Fluent English and Chinese to be able to collaborate effectively with teams in China

Experienced in R&D team management, strong project management & cross-team communication skills, able to work under pressure.