Lead and mentor a diverse team of researchers and engineers in the development of advanced packaging solutions that align with the company's strategic direction.
Manage multiple R&D projects through the full development lifecycle-conceptualization, design, prototyping, and implementation-ensuring timely delivery within budgetary parameters.
Collaborate cross-functionally with teams such as Product Development, Manufacturing, and Quality Assurance to ensure smooth integration of new technologies into production processes.
Monitor industry trends and emerging technologies in advanced packaging, driving innovation and contributing to the company's long-term technological leadership.
Prepare and present research findings, progress updates, and recommendations to senior management and relevant stakeholders to support informed decision-making.
Qualifications
A Master's degree or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a closely related field.
At least 8 years of relevant industry experience, including 3 years or more in a managerial or leadership capacity overseeing R&D or technology projects.
Strong technical knowledge in areas such as System-in-Package (SiP), Fan-Out Wafer-Level Packaging (FOWLP), and Heterogeneous Integration.
Demonstrated ability to manage complex projects, including planning, resource coordination, and risk management.
Strong analytical, problem-solving, and communication skills, with the ability to address technical challenges and influence stakeholders effectively.
