Production & Technical Support Technician (Die Attach/Wire Bond/Wafer Saw/Dicing)

2-5 years
3 days ago 1 Applied
Job Description

Job responsibilities:

  • Performs machine & process setup
  • Perform Troubleshooting and maintenance of wire bonder and die attach machines
  • Maintain a good machine Uptime
  • Ensure the quality product is manufactured on schedule within the customer's requirement
  • Work with Cross functional Departments to resolve safety, quality and productivity related issue and improvement.
  • Manage the logistic for parts so as to sustain production line.
  • Support any ad-hoc duties.

  • Diploma / Nitec/ ITE in mechanical / Electrical / Electronic Engineering
  • Processed basic technical knowledge in machine repair and troubleshooting.
  • Minimum 2 year experience in mass production / engineering environment
  • Preferably with 2 year hand on experience in repair and troubleshooting of following machines:
    1. Esec Die Attach/wire bonder
    2. ASM Die Attach/wire bonder
    3. DISCO Wafer Saw

We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671





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