Processed basic technical knowledge in machine repair and troubleshooting.
Minimum 2 year experience in mass production / engineering environment
Preferably with 2 year hand on experience in repair and troubleshooting of following machines:
Esec Die Attach/wire bonder
ASM Die Attach/wire bonder
DISCO Wafer Saw
We regret that only shortlisted candidates will be notified. GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671