Technical Product Management
- Lead, coach and develop Product Line team members, including workload planning, performance feedback and competency development.
- Ensure Product Specialists maintain the technical expertise required to support demanding customer applications and requirements.
- Coordinate software feature planning, release priorities and product requirements with Engineering.
- Serve as the primary technical interface for Customer Project Managers regarding product capabilities, CERs and technical enquiries.
- Collaborate with Engineering to define solutions that meet customer-specific requirements.
- Gather, define and prioritize product requirements, CERs and CIP initiatives in line with customer needs, product strategy and business objectives.
- Contribute to product roadmaps and drive continuous improvement through market analysis, customer feedback, competitive benchmarking and machine capability assessments.
- Monitor product and machine performance, identifying and driving capability improvements where needed.
- Lead customer evaluations, demonstrations, benchmarking activities and process development projects.
- Ensure availability of high-quality technical documentation, product updates and training materials for customers, CPMs, Service teams and FSEs.
Pre- & After Sales Support
- Support CPMs and Sales during pre-sales activities with technical product know-how and application guidance.
- Establish technical customer relationships with the assigned key accounts.
- Provide technical information, product updates and application feedback to CPMs, Service, Sales and Engineering Teams.
Requirements
Education
- Degree in engineering, Bachelor / Master or equivalent
Work experience
- Minimum 8 years of experience in a complex Technical environment, 5 years of experience in die attach applications, preferably soft soldering or Sintering processes.
- Experience in the semiconductor backend industry, ideally in product management, application engineering or project management.
- Good understanding of power semiconductor packaging (e.g. SiC, GaN, IGBT, MOSFET, power modules, DBC/AMB substrates, leadframe packages and advanced die attach processes)
Expertise and methodology
- Good PC, MS-Office knowledge
Other requirement criteria
- Excellent communication skills
- High level of assertiveness
- High degree of flexibility required
- Good behavior in customer relations
- MS-Office Intercultural understanding
- Travel readiness
