About WhiteCrow
We are global talent research, insight, and sourcing specialists with offices in the UK, USA, Singapore, Malaysia, Hong Kong, Dubai, and India. Our international reach has helped us to understand and penetrate specialist markets at a global level. In addition to this, our service is also extended to complement our client's in-house talent acquisition teams.
About our client
Our client is a global technology leader specializing in advanced memory and storage solutions that power next-generation computing and data-driven applications. With strong expertise in semiconductor innovation, the organization develops high-performance memory technologies across DRAM, NAND, and storage platforms for applications spanning data centers, artificial intelligence, mobile devices, client computing, and intelligent edge ecosystems.
Driven by a commitment to technology advancement, operational excellence, and customer-centric innovation, the company plays a significant role in enabling modern digital infrastructure and compute-intensive workloads worldwide.
As a Product Integration Lead, HIG High Bandwidth Memory, you will be responsible for...
- Manage technical inputs and drive silicon-to-system alignment using the Success Criteria Document (SCD).
- Collaborate with HBM Architecture, Product Engineering, Systems Engineering, Business Units, Technology Development, Packaging, and Global Quality teams.
- Identify and resolve gaps between HBM product capabilities and system requirements.
- Manage HBM sample planning and delivery aligned with customer and system development timelines.
- Lead technical triage for System and Chip Feature Interaction issues, driving ownership and mitigation plans.
- Manage qualification definitions and late/post-qualification changes through the Change Control Board.
- Drive technical issue resolution while balancing development schedules, risks, and costs.
- Communicate development priorities across HBM teams to ensure system specification compliance.
What you already have...
- Bachelor's or Master's Degree in Electrical Engineering or Computer Engineering.
- 10+ years of experience in Product Engineering, Design Engineering, Yield Enhancement, or related semiconductor engineering disciplines.
- Experience leading product development projects is highly desirable.
- Strong ability to lead complex technical issues to closure through cross-functional collaboration.
- Knowledge of HBM, DRAM devices, semiconductor product development, and system architecture is preferred.
- Excellent communication, stakeholder management, presentation, and technical leadership skills.
Skills:
- High Bandwidth Memory (HBM) Technology
- DRAM Technology & Memory Architecture
- Process & Product Characterization
- Chiplet & Heterogeneous Integration
- HBM Architecture and Operation
