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Key Responsibilities:
Reporting Line: CEO/GM
Etch Technology Leadership: Directing advanced plasma dry etch recipe development (CCP, ICP, ALE, Conductor/Dielectric, Deep Silicon Etch) to meet customer specs for profile, selectivity, CD uniformity, and defectivity.
Customer JDPs & Tool Evaluations: Leading joint development projects (JDPs) and competitive tool-of-record (TOR) evaluations at top-tier wafer fab customer sites.
Team Management: Leading and mentoring field process application managers, principal engineers, and customer support specialists across demo labs and fab sites.
Hardware-Process Co-Optimization: Partnering with R&D on next-generation etch chamber design, plasma source optimization, and RF/gas chemistry delivery systems.
Escalation & Root-Cause Resolution: Directing structured problem solving (8D, PFMEA) for complex process-hardware excursions in volume manufacturing.
Qualifications:
Education: Master's or Ph.D. in Chemical Engineering, Materials Science, Physics, or Electrical Engineering.
Experience: 12+ years of dry etch process development experience, including 5+ years in a senior management/director role at a capital equipment OEM or leading foundry/IDM.
If you are interested in exploring this role, or if you have relevant industry contacts who might be interested, please reach out directly with a CV to: [Confidential Information]
EA: 94C3609 | R22105422
Job ID: 153366901