Key Job Accountabilities :
- To work closely with AOI/process/equipment engineering team to swiftly contain high Defect Density and inline excursions and find root causes and provide working solutions to satisfy customer quality
- Reviews unresolved requests for adjustment of complaints and reads customer comments to determine basis of complaint and plan of action needed to resolve complaint.
- To drive process improvement plan based on systematic analysis of inline/Electrical Test/yield data to meet quality and yield targets.
- To identify key process weaknesses and perform fine tuning on existing processes for continuous improvement to yield/quality/productivity and cost.
- To use statistical knowledge (e.g. DOE, SPC) and systematic problem-solving techniques (e.g. 8D, 5 Whys) to determine root causes for low yield wafers/lots as well as developing containment/corrective/preventive action plans.
- Lead process control plan update and customer audit.
Required Experience and Qualifications:
- Requires Degree in Physics, Chemistry, Material Science, Mechanical/Chemical/Electrical Engineering or equivalent
- 5 to 10 years of relevant experience in wafer bumping, wafer fabrication or packaging
- Preference will be given to candidates with strong knowledge in process integration scheme/ process stability and yield enhancement activities.
