Process Engineer (Wire Bond)

3-6 years
5 days ago
Job Description

Job Description:

  • To ensure products produced meet the product and customers quality requirement
  • To develop or improve the processes to gain productivity, efficiency, quality and costs.
  • To qualify new materials, products, processes.
  • To co-ordinate NPI/NPQ activities with details and meeting timeline.
  • Conduct supplier sourcing and qualification activities jointly with purchasing, engineering and quality department
  • Proficiency in wire bonding, hands on experience is an requirement
  • To support and resolve daily technical issues in operations
  • To support analysis of failures from yield loss, reliability failures, new products, new materials.
  • To support company new initiatives such as new tape development, new material development.
  • To benchmark new materials, new equipment technology in the market.
  • To support quality, sales team in customers initiative such as process improvement, yield improvement.
  • Develop and update Standard Operating Procedures when required
  • Conduct training on new equipment and new process
  • Support customers audit and external agencies audit

  • Minimum Diploma, or Degree in Electronic or Material Science Engineering
  • Minimum 3 years working experience in manufacturing environment, preferably in Semiconductor environment.
  • Hands on experience in wire bonding is a must
  • Hands on experience with Cu/Ag wire bonding is a plus
  • Experience in Assembly and test processes of Dicing, die attach, wire bond, encapsulation, testing, especially on wire bonding
  • Knowledge in material science of the materials used in assembly of IC chips
  • Experience in maintenance of Assembly and test machines of Dicing, die attach, wire bond, encapsulation, testing, especially on wire bonding
  • Experience in ESEC, ASM, KNS wire bonders,
  • Experience in Gold and Silver wire bonding process will be an advantage
  • Able to multi-tasks, and work in a fast-paced environment
  • Good team player, able to work independently, resourceful, willing to learn new skills, with good initiatives
  • Knowledge in FMEA, SPC, OCAP, DOE

We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671





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