To ensure products produced meet the product and customers quality requirement
To develop or improve the processes to gain productivity, efficiency, quality and costs.
To qualify new materials, products, processes.
To co-ordinate NPI/NPQ activities with details and meeting timeline.
Conduct supplier sourcing and qualification activities jointly with purchasing, engineering and quality department
Proficiency in wire bonding, hands on experience is an requirement
To support and resolve daily technical issues in operations
To support analysis of failures from yield loss, reliability failures, new products, new materials.
To support company new initiatives such as new tape development, new material development.
To benchmark new materials, new equipment technology in the market.
To support quality, sales team in customers initiative such as process improvement, yield improvement.
Develop and update Standard Operating Procedures when required
Conduct training on new equipment and new process
Support customers audit and external agencies audit
Requirements:
Minimum Diploma, or Degree in Electronic or Material Science Engineering
Minimum 3 years working experience in manufacturing environment, preferably in Semiconductor environment.
Hands on experience in wire bonding is a must
Hands on experience with Cu/Ag wire bonding is a plus
Experience in Assembly and test processes of Dicing, die attach, wire bond, encapsulation, testing, especially on wire bonding
Knowledge in material science of the materials used in assembly of IC chips
Experience in maintenance of Assembly and test machines of Dicing, die attach, wire bond, encapsulation, testing, especially on wire bonding
Experience in ESEC, ASM, KNS wire bonders,
Experience in Gold and Silver wire bonding process will be an advantage
Able to multi-tasks, and work in a fast-paced environment
Good team player, able to work independently, resourceful, willing to learn new skills, with good initiatives
Knowledge in FMEA, SPC, OCAP, DOE
We regret that only shortlisted candidates will be notified. GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671