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Responsibilities
Required competencies and certifications
Job ID: 151378535
Skills:
Process Control System Recipe Models, Manufacturing Operating Instructions, Technical Assessment, Process Engineering, Technical Knowledge, Standard Operating Procedures
Skills:
Lift off, WET Process, Microsoft Applications, WET Resist Strip, Wafer cleaning processes, wafer process engineering, wafer fab manufacturing processes, Equipment Maintenance, Wet Etch, Single wafer lift off
Skills:
simulations , unisim , Process and Utility Flow Diagrams, Flare System Analyser, Piping Instrumentation Diagrams, Sizing and Hydraulic Calculations, Process Engineering, PIPENET, Equipment and Instrument Process Datasheets, Hysys, SAFE Charts
Skills:
Data Analysis, Advanced Packaging Process Development, Spc, FDC, advanced analytics tools, Metrology, Flip Chip Assembly, engineering principles, Thermo-Compression Bonding, Hybrid Bonding, AI automation, reliability data, process characterization, statistical methods, DOE methodologies
Skills:
Scripting, Agile, AOI, Microsoft Office, Engineering Sample DOE, Fmea, Parametric Yield improvement, sputtering, 7 Qc Tools, Programming macro, photolithography, NPI Prototyping, RF filter products, CpK, Bonding, Prototype EVT, Backgrinding, Product Yield Quality, Cycle Time Target, Jmp, Statistical Process Control, Dicing, process integration, Plating, Defectivity