Optimize and characterize semiconductor assembly processes through structured experiments and test planning.
Lead cross-functional teams to enhance product performance, improve yield, and ensure product robustness.
Develop and implement new materials, technologies, and automation solutions for process advancements.
Evaluate manufacturing processes to meet stringent customer requirements and establish standardized equipment operating procedures.
Set up, calibrate, and fine-tune optical components and systems for proof-of-concept testing.
Conduct statistical data analysis, modeling, and Design of Experiments (DOE) to drive process improvements.
Requirements:
Min. Master's degree in Mechanical Engineering, Material Science, Physics, or other relevant fields.
Experience in automatic machine setup, optimization, and troubleshooting within high-volume precision manufacturing, assembly, or semiconductor industries.
Familiarity with wire bonders or other semiconductor backend equipment is an advantage.
Strong analytical skills with experience in statistical data analysis, DOE, and data modeling.
Excellent communication and presentation skills to collaborate effectively with internal and external stakeholders.
