About STMicroelectronics
At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com
YOUR ROLE
- Manage a cost-effective wafer fabrication process by providing engineering support to the production line to achieve the organization's targeted manufacturing performance. Take full ownership of all engineering issues for the assigned process.
- Maintain and support day-to-day manufacturing activities through real-time problem analysis and timely implementation of effective solutions.
- Ensure smooth process flow with high quality, high yield, and low cost by working closely with Maintenance Specialists, Production Supervisors, and Shift Engineers to achieve committed targets.
- Provide cross-functional, cross-department, and cross-fab support based on operational needs and priorities.
- Train new engineers and share technical knowledge to support team development.
- Support shift operations as needed and return to normal shift assignment for process/project work when assigned.
- Take responsibility for trench etch processes within the poly team.
YOUR SKILLS & EXPERIENCES
- Bachelor's degree in Electrical/Electronics Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering or a related discipline.
- Around 2 years of experience with trench etch processes and the associated challenges, including profile control and process stability.
- Ability to conduct real-time problem analysis for SPC OOC/OOS, defect failures, and FDC failures, and determine appropriate solutions by working with all relevant stakeholders.
- Ensure all basic inline investigations are reported in real time to the relevant owners with complete and accurate details.
- Ability to set up process recipes for newly introduced processes.
- Ability to establish a robust process control system to maintain the lowest possible Wafer at Risk (WAR) level, maximize the signal-to-noise ratio for SPC and FDC, and minimize human dependency.
