- Opportunity to work on futuregeneration process technologies
- Strong career progression pathways across R&D and HVM.
About Our Client
This is a global, toptier semiconductor manufacturer with longstanding operations across R&D and highvolume manufacturing in the world. The organization is known for pushing process technology forward while maintaining a stable business footprint and deep partnerships. Engineers here work in fabs and development lines, collaborate across crossfunctional, multisite teams, and see their work translate into highimpact, widely deployed products. The culture values technical rigor, datadriven decisions, and continuous learning, offering clear pathways for technical growth and leadership.
Job Description
- Develop, optimize, and characterize dry etch processes for complex structures across multiple layers (oxide, nitride, polysilicon, carbon, metals).
- Engineer profile control, selectivity, etchtofilm interactions, critical dimension (CD) stability, and acrosswafer uniformity.
- Conduct advanced DOE, SPC, and defectbased investigations to tighten process windows and improve stability.
- Work on HAR etch, trench/contact etch, slit/wave/wiring cuts, hardmask patterning, and complex stacks.
- Evaluate plasma chemistry, ion/radical dynamics, RF tuning, and chamber conditions that influence profile consistency and line integrity.
- Own etch chambers through installation qualification release.
- Conduct chamber matching, hardware evaluation, seasoning strategy optimization, and new chemistry trials.
- Work closely with equipment suppliers on tool improvements, hardware upgrades, and modulelevel enhancements.
- Partner with Process Integration, Metrology, Thin Film, Photo, and Wet Process teams to ensure seamless module alignment.
- Support silicon builds, early process flow validations, and transfertomanufacturing milestones.
- Provide direction for longterm etch roadmap development.
- Mentor junior engineers, lead problemsolving sessions, and drive collaborative learning.
- Represent the module in crosssite technical alignment, reviews, and decisionmaking forums.
The Successful Applicant
- Handson experience with ICP, CCP, RIE, or advanced plasma etch systems used for semiconductor fabrication.
- Strong understanding of plasma chemistry, RF power control, ion directionality, polymer control, profile shape engineering, and etch uniformity.
- Familiarity with 300mm etch equipment from LAM, TEL, AMAT, or equivalent.
- Proficiency in DOE, SPC, FDC/ADC, rootcause analysis, and process window exploration.
- Experience using CDSEM, XSEM, profilometry, OES endpoint systems, and inline metrology tools.
- Strong analytical thinking and structured problemsolving.
- Excellent communication for crossfunctional alignment.
- Ability to manage multiple projects with high ownership.
What's on Offer
You can expect a highimpact engineering environment with the opportunity to contribute to advanced semiconductor process development alongside experienced technical leaders. The position offers access to cuttingedge tools, collaborative project work, and the ability to influence meaningful improvements within a core technology area. Engineers in this team benefit from a supportive growth framework, exposure to crossfunctional problemsolving, and a pathway to expand both technical depth and organizational influence. Overall, it's an opportunity to work on challenging, forwardlooking technologies within a stable and globally recognized industry setting.
Contact
Timothy Huang (Lic No: R1980928/ EA no: 18S9099)
Quote job ref
JN-012026-6918416
Phone number
+65 6416 9863
