Principal Equipment Engineer (Semicon, CMP)

Key Responsibilities:

• Equipment OEE & Tool Reliability: Maximizing tool availability, Mean Time Between Failures (MTBF), and reducing Mean Time to Repair (MTTR) across AMAT (Mirra/Reflexion) and EBARA (FREX/F-REX) polishers and cleaners.

• Hardware Modifications & Upgrades: Leading tool retrofits, chamber modifications, platen conditioning system enhancements, and optical/eddy-current endpoint hardware integration.

• Preventative Maintenance & Cost Optimization: Defining PM schedules, optimizing spare parts consumption, managing second-source hardware qualifications, and reducing total cost of ownership (CoO).

• Vendor & CapEx Management: Managing equipment OEM performance, negotiating service level agreements (SLAs), and leading tool selection, installation, and hookup for new fab expansion lines.

• Excursion Resolution & Safety: Directing root-cause failure analysis (8D, FMEA) for major equipment breakdowns, slurry delivery system failures, and maintaining EHS compliance across wet chemistry bays.

Qualifications:

• Education: Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, Mechatronics, or related discipline.

• Experience: 8+ years of hands-on CMP equipment engineering experience in a high-volume 200mm or 300mm wafer fab environment.

If you are interested in exploring this role, or if you have relevant industry contacts who might be interested, please reach out directly with a CV to: [Confidential Information]

EA: 94C3609 | R22105422