Principal Engineer - Plating Process

Here's a compliant and anonymized rewrite that keeps the role strong while aligning with MOM fair employment guidelines:

Technical Qualifications

• Strong expertise in NiPd plating or electroplating processes within semiconductor manufacturing.

• Hands-on experience in plating process development, troubleshooting, and manufacturing support.

• Experience working with electroplating equipment (e.g., APS or equivalent platforms), including setup, operation, process optimization, and qualification.

• Solid understanding of electroplating bath chemistry, bath health monitoring, and process control techniques.

• Experience with bath analysis and familiarity with industry-standard monitoring tools and methods (e.g., Nova Ankolyzer or similar systems).

• Practical experience in equipment troubleshooting, process stabilization, and defect reduction.

• Good understanding of process integration, yield improvement, and defect analysis methodologies.

• Familiarity with metrology and analytical techniques relevant to plating processes, including thickness measurement, surface inspection, composition analysis, uniformity assessment, and contamination monitoring.

• Strong analytical and problem-solving skills, including experience in DOE, SPC, and structured root cause analysis.

• Experience supporting technology transfer from development to manufacturing environments.

• Effective communication skills, with the ability to present technical findings clearly to both technical and non-technical stakeholders.

• Working knowledge of semiconductor fab safety standards, quality systems, documentation practices, and compliance requirements.

Preferred Experience

• Experience in semiconductor manufacturing environments, particularly in high-volume production or technology transfer settings.

• Background in wet process or electroplating equipment ownership and process support.

• Ability to contribute effectively within cross-functional teams to address complex technical challenges.

• Demonstrated improvements in bath stability, plating uniformity, yield, and overall process capability.

• Experience contributing to innovation initiatives, continuous improvement efforts, or intellectual property development.

• Exposure to quality management systems (e.g., ISO), operational excellence practices, and equipment maintenance strategies.

Education and Experience

• Degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.

• Relevant experience in electroplating or NiPd process engineering within semiconductor manufacturing.

• Ability to work effectively in a dynamic and collaborative manufacturing environment.

• Demonstrated strengths in technical ownership, problem-solving, and cross-functional collaboration.

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