Your Role
Key responsibilities in your new role
- Drive MEMS Package Technology Development at Infineon, from concept to high-volume ramp-up.
- Act as the lead engineer and primary point of contact for direct communication with Infineon's key customers regarding MEMS package technology.
- Perform process development activities (including parameter scouting, optimization, verification, and process freeze) within development projects to achieve targets related to timeline, quality, cost competitiveness, and manufacturability.
- Define and drive technical specifications (BOM, package design, assembly process) for MEMS package projects involving major changes, risks, or new introductions.
- Lead a global team of process development engineers to successfully execute multiple MEMS package NPI (New Product Introduction) projects. Share your technical expertise and foster professional growth within your team.
- Serve as the partner and technical consultant for package definition activities, collaborating closely with the Business Division, particularly on aspects of MEMS and Silicon Microphone back-end (BE) assembly technology.
- Provide support during the pre-development and project definition stages, maintaining your role as the package design expert throughout the project lifecycle.
- Innovate novel MEMS package concepts, leveraging your experience as a technical leader.
Your Profile
Qualifications and skills to help you succeed
- Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, or similar).
- Minimum of 9 years of relevant experience in MEMS package technology development.
- Demonstrated success and proven track record in developing innovative MEMS Silicon Microphone technologies.
- Experience in representing your company as a MEMS package expert, with direct communication to Tier 1 customers.
- Comprehensive knowledge of MEMS packaging processes, materials, and equipment engineering.
- Proven ability to lead and mentor a team of process development engineers in MEMS package development.
- Hands-on experience collaborating with OSATs (Outsourced Semiconductor Assembly and Test providers) in package development projects.
- Expertise in Failure Analysis and Reliability Engineering methodologies.
- Strong analytical and problem-solving skills including 8D and FMEA.
- Proficiency in AutoCAD and 3D drafting tools.
- Highly motivated, driven to excel and grow within Infineon, and thrives on tackling challenges to deliver innovative solutions
