Your Role
Key responsibilities in your new role
- Package Design and Development: Design and develop Flip chip BGA and Wirebond BGA Package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.
- Technical Advisor: Provide technical guidance and expertise to OSAT partners on package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies.
- Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials.
- Problem-Solving and Analysis: Apply a systematic approach to problem-solving, generating analysis, and hypothesis to draw conclusions and derive lessons learned.
- Project Management: Collaborate closely with subcon partners to identify, analyze, and resolve technical issues that may impact project timelines, budgets, or scope.
Your Profile
Qualifications and skills to help you succeed
- Min. Bachelor / Master's degree in Material Science, Mechanical, Electrical, Chemical Engineering / Physics or equivalents
- Min. 10 years of experience in package development, process development (assembly), and project management, with a focus on New Product Introduction (NPI) and change/transfer projects for automotive products.
- Good technical knowledge of Back End processes & material knowledge in bumping and laminate packages and interaction with the different functions (e.g. design rules, direct materials and processes qualification).
- Good understanding of Automotive quality / reliability requirements and standards.
