Brief Summary
Join a dynamic team as a Process Integration professional, where you will influence transformation initiatives and contribute to CMOS development projects through collaboration and continuous improvement.
Responsibilities
- Identify, troubleshoot, and enhance process integration and yield-related issues. Conduct project management and perform data analysis for process improvements. Collaborate with cross-functional teams to mitigate defects and resolve technical challenges. Develop tailored processes and support new designs with characterization and design rule development. Drive continuous improvement plans to meet organizational goals. Construct and enhance test structures for effective process characterization and defect analysis. Maintain thorough documentation of processes while evaluating failure modes and ensuring mitigation measures are established. Conduct product/process partitioning studies for yield and defect characterization to promote defect reduction. Ensure compliance with all Environmental, Health, Safety and Security requirements while performing all activities responsibly. Participate in other project-related tasks and assignments as necessary.
Requirements
- Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related engineering discipline. Minimum of 7 years of experience in semiconductor process integration or yield engineering. Deep knowledge of semiconductor manufacturing processes, yield improvement techniques, defect characterization, and root cause analysis. Proficient in statistical methodologies such as Statistical Process Control (SPC), Design of Experiments (DOE), and Failure Mode and Effects Analysis (FMEA). Experience in data analysis, process characterization, and leading continuous improvement initiatives in high-volume production environments. Strong analytical, problem-solving, and communication abilities, with a proactive approach and a commitment to high quality and compliance with documentation and EHS standards.
