Principal Engineer/MTS Member of Technical Staff, HIG-HBM Product System Engineering (Media Health)

About WhiteCrow

We are global talent research, insight, and sourcing specialists with offices in the UK, USA, Singapore, Malaysia, Hong Kong, Dubai, and India. Our international reach has helped us to understand and penetrate specialist markets at a global level. In addition to this, our service is also extended to complement our client's in-house talent acquisition teams.

About our client

Our client is a global technology leader specializing in advanced memory and storage solutions that power next-generation computing and data-driven applications. With strong expertise in semiconductor innovation, the organization develops high-performance memory technologies across DRAM, NAND, and storage platforms for applications spanning data centers, artificial intelligence, mobile devices, client computing, and intelligent edge ecosystems.

Driven by a commitment to technology advancement, operational excellence, and customer-centric innovation, the company plays a significant role in enabling modern digital infrastructure and compute-intensive workloads worldwide.

As a Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health), you will be responsible for...

• Leading Media Health Manufacturing activities for DRAM, Interface Die, and stacked HBM products.
• Optimizing manufacturing test coverage for current and future HBM architectures and process nodes.
• Developing, validating, characterizing, and qualifying next-generation HBM products.
• Supporting design verification and circuit debug using CAD tools and Verilog simulations.
• Improving manufacturing yield, reducing test time, and optimizing device reliability.
• Driving root-cause analysis and resolution of manufacturing test flow, qualification, and RMA issues.
• Promoting innovation in Design-for-Test (DFT), manufacturing strategy, and test optimization.
• Mentoring engineers and developing technical and project management capabilities within the team.
• Leading technical decision-making, risk analysis, and project prioritization.
• Collaborating with Fab, HBM Technology Development, Design, System Development, Test Solution Engineering, and Quality/Reliability teams.

What you already have...

• Bachelor's or Master's Degree in Electrical & Electronics Engineering.
• 8+ years of semiconductor industry experience with Product Engineering experience preferred.
• Strong leadership, circuit analysis, and root-cause problem-solving skills.
• Knowledge of statistics, scripting, and data analysis tools.
• Ability to adapt to technical leadership and people leadership responsibilities.
• Proven collaboration across cross-functional engineering organizations.
• Strong accountability, communication, and presentation skills.
• Passion for mentoring and developing engineering talent.
• Willingness to work onsite in Singapore and travel internationally (US, Taiwan, Japan).
• Skills: High Bandwidth Memory (HBM) Architecture, Reliability Characterization, Reliability Risk Assessment, Test Coverage Optimization, Defectivity Analysis.