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4,500 SGD 8,000 SGD
Manufacturing(Electronics/Semiconductors)
Our client is launching a new business and establishing a new factory in Singapore. They are seeking a talented Plating Process Engineer to join their team and contribute to advanced substrate manufacturing.
Reports to: R&D Manager
Responsibilities
1. Process Development
- Develop and optimize plating processes (e.g., electrolytic copper, Ni/Sn).
- Evaluate new chemicals, materials, and equipment for plating process enhancement.
- Establish plating parameters to ensure uniform thickness, adhesion, and reliability.
2. Process Control & Monitoring
- Monitor plating bath chemistry and maintain proper control limits.
- Implement Statistical Process Control (SPC) and DOE to analyze process capability.
- Troubleshoot process and equipment issues to improve yield and throughput.
3. Yield & Quality Improvement
- Conduct root cause analysis of plating defects.
- Work with quality and reliability teams to address substrate failure mechanisms.
- Drive continuous improvement initiatives to enhance quality and cost efficiency.
4. Cross-Functional Collaboration
- Interface with design, manufacturing, equipment, and suppliers to meet production goals.
- Support new product introductions (NPI) and qualification of plating processes.
5. Documentation & Compliance
- Maintain detailed documentation of plating recipes, process controls, and specs.
- Ensure compliance with environmental, safety, and regulatory standards (e.g., RoHS, REACH).
6. Ad-hoc duties
- Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.
Requirements & Preferences
(Must)
- PhD or Master's degree, Bachelor's degree in Chemical Engineering, Materials Science, or related field.
- 5-10+ years of experience in semiconductor packaging or PCB/substrate manufacturing.
- Hands-on experience with copper/nickel/tin plating processes.
- Familiarity with tools such as XRF, SEM, profilometer, and electroplating equipment.
- Knowledge of surface treatment, adhesion promotion, and via filling techniques.
- Familiar with lean manufacturing, Six Sigma, or SPC tools.
(Advantageous)
- Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.
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What you will receive
- AWS
- Variable Bonus (based on company and individual performance)
- Annual Leave: 16 days (up to a maximum of 20 days)
- Medical Leave
- Family care leave (2 days/year)
- Dental care
- Company phone will be provided
8:00 17:00
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As one of the leading Japanese Recruitment Agencies in Singapore, Reeracoen Singapore offers professional recruitment solutions extending across temporary, contract, permanent and outsourcing to the Singapore workforce. We take pride in our solutions provided to our business partners, assisting not only job seekers in finding suitable employment but also supporting business enterprises in talent acquisition.
Job ID: 145362135
