Purpose of the Job
- To lead the development, optimization, and stabilization of plating and etching processes for advanced semiconductor packaging, contributing to mass production readiness, yield improvement, and customer-specific technical solutions.
Key Job Accountabilities:
- Develop and optimize electroplating, seed etching, and PR stripping processes
- Design and improve processes for TSV, RDL, Cu pillar, and micro bump formation
- Evaluate and introduce new materials and equipment for plating/etching process integration
- Conduct pre-production process validation and yield stabilization
- Perform DOE planning and analyze experimental data using statistical tools (e.g., SPC, Minitab, JMP)
- Develop customized processes and provide technical support for customer programs
- Set up equipment and optimize operating conditions in coordination with vendors
- Troubleshoot quality issues across plating and etching processes
- Support development of advanced packaging technologies including 2.5D, fan-out, and SiP
Required Experience and Qualifications:
- Bachelor's degree or higher in Engineering or Science (e.g., Materials Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials
- Minimum 3 years of hands-on experience in plating, etching, or stripping processes in semiconductor manufacturing.
- Fundamental understanding of advanced semiconductor fabrication and integration processes
- Strong skills in experiment design, statistical data analysis (e.g., SPC, Minitab, JMP), and technical reporting
- Proficiency in preparing technical documentation and delivering presentations
- Ability to communicate technical content clearly in English (written and verbal)
- Basic knowledge of semiconductor process equipment and materials
- Experience in key back-end processes such as TSV, RDL, and micro bump
- Knowledge of advanced packaging technologies including 2.5D, fan-out, and flip-chip
- Familiarity with related processes such as photo, chip attach, and underfill
- Proven experience in joint development projects with global customers
- Hands-on collaboration with material or equipment suppliers for co-evaluation or integration
- Expertise in process reliability testing (e.g., thermal cycling, HAST)
- Experience in process automation or smart fab environments
- Working proficiency in tools such as AutoCAD or ANSYS
- In-depth understanding of etch/strip conditions for back-end photoresist materials
