Company:
RF360 Singapore Pte., Ltd.
Job Area:
Engineering Group, Engineering Group > Hardware Engineering
General Summary:
Description:
Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program Management, Product Marketing, Quality, Reliability, Operations, Customer Engineering, Supplier Quality, and internal and external manufacturing partners.
This position requires a senior technical specialist who owns end‑to‑end packaging technology and product integration, including wafer pre‑assembly (wafer BE), spanning technology development, chip‑to‑package co‑design, NPI, high volume manufacturing (HVM) interaction, and customer lifecycle support, to deliver robust and scalable solutions.
Responsibilities:
- Operate as a senior technical lead in a global, cross‑functional matrix, driving technology readiness, execution, and product timelines.
- Drive development and integration of Si and GaAs packaging processes from wafer‑level interconnect and RDL through Cu pillar bumping, singulation, and flip‑chip assembly.
- Lead and qualify wafer singulation technologies, including stealth dicing and plasma dicing, with ownership of die strength, edge quality, yield, and reliability tradeoffs.
- Drive substrate and assembly solutions for RF SiP applications.
- Own end‑to‑end technology integration into products, including wafer‑level and package‑level risk assessment, mitigation, and release readiness.
- Develop and maintain packaging design rules aligned with manufacturing and reliability constraints.
- Leverage FAB BEOL process knowledge to manage upstream impacts on bumping, singulation, and pre‑assembly.
- Serve as the technical interface to OSATs, leading technology transfer, qualification, and new OSAT bring‑up from development through production.
- Drive SPC, FMEA, PCN, change control, audits, and benchmarking to ensure smooth ramp and HVM stability.
- Own yield, quality, throughput, and reliability improvements to ensure successful ramp and sustained HVM product integrity.
- Plan and execute DOE to optimize bump, die sort, yield, and CPI performance.
- Lead failure analysis, root cause resolution, and reliability learning during NPI and HVM.
- Support customer NPQ, RMA analysis, and direct customer technical communication.
- Contribute to value engineering and cost reduction initiatives.
- Explore and evaluate future 2.5D packaging technologies, assessing feasibility, integration risks, and manufacturing readiness.
Qualifications:
- Master's degree in mechanical, Materials, Chemical, or Electrical Engineering; PhD preferred.
- 10+ years experience in semiconductor packaging, preferably RF modules / SiP.
- Demonstrated ownership across technology development, NPI, HVM, and customer support.
- Hands‑on experience in wafer pre‑assembly / wafer BE, including Cu pillar or micro‑bump bumping, wafer singulation (stealth dicing, plasma dicing), and die sort.
- Demonstrated ability to debug and resolve wafer‑level yield, die integrity, and reliability issues impacting downstream assembly and HVM.
- Strong understanding of packaging materials, process interactions, failure mechanisms, and reliability.
- Hands‑on experience with tier‑1 foundries and OSATs.
- Working knowledge of industry standards (IPC, JEDEC, IEEE, ISO, ANSI).
- Experience in qualification, reliability testing, and failure analysis.
- Solid foundation in statistics, SPC, and FMEA.
- Strong cross‑functional communication and leadership skills.
- Willingness to travel internationally (once per quarter).
Minimum Qualifications:
- Bachelor's degree in engineering or related field and 6+ years of relevant experience; or
- Master's degree in engineering or related field and 5+ years of relevant experience; or
- PhD in Engineering or related field and 4+ years of relevant experience.
Minimum Qualifications:
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [Confidential Information] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.
If you would like more information about this role, please contact Qualcomm Careers.
