Package Development Engineering – Product Integration Engineer (PDE PIE)

• Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness.

• Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work.

• Driving New Product Introduction process through NPI Phase Gate Review.

• Coordinating new product start-up to achieve first pass qualification.

• Understand new product start-up datelines, product applications and customer requirements and communicate this information to the new product start-up team

• Working with process / equipment / manufacturing / planning area owners to bring new product and package into volume production.

• Providing timely support of First silicon, Engineering samples, Qual samples and meeting expectation on Engineering Hot lots cycle time as per Product Development Team (PDT) schedule.

• Regular monitoring the product yield trend Quality Deviation Record (QDR) and reliability to ensure that assembly operation is in control and initiate early attention if necessary.

• Drive Electrical Failure Analysis (EFA) / Physical Failure Analysis (PFA) closure for NPI issues, including:

• Assembly failures (crack, delamination, shorts, opens, warpage)

• Test failures

• Reliability failures

• Owning the entire Product Life Cycle, from NPI to End of Life (EOL).

• Understanding new product challenges and collaborating with Process / Equipment/Development owners to develop new technology capabilities ahead of market

• Act as the technical integrator across multiple manufacturing sites and partners (Design, NPI, Site Process & Equipment, Package Reliability, Test, Quality)

• Acting as a point of contact to Technical Program Manager (TPM) on product related matters.

Minimum Required Qualifications/Experience

Education

• Minimum Bachelor's degree in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor or related Engineering discipline

Experience

• Fresh graduate with strong passion in semiconductor engineering is encouraged to apply.

Technical Skills

• Strong understanding of:

• Advanced package assembly flows and able to understand design geometry

• Various Die stacking, thin substrates, mold compound, warpage, and mechanical reliability

• NPI qualification frameworks (Qual, Low Volume Manufacturing, Post Release Qualification)

• Hands on experience with:

• Yield analysis, statistical data interpretation

• Failure analysis methodologies

• Process characterization and validation

• Familiarity with:

• Phase Gate / NPI/ Technology Development (TD) business processes

• Cross site manufacturing transfers

Soft Skills & Leadership Attributes

• Strong ownership mindset with ability to lead without authority.

• Thrive in working in a fast-evolving NPI environment

• Able to balance technical depth with execution speed

• Strong analytical, logical, and critical thinking skills

• Effective communicator, able to collaborate across all levels

• Growth mindset with a passion for continuous learning

• Internship or experience in the semiconductor industry is a plus

• Demonstrated leadership and a track record of impact are highly desirable

• Interest in and knowledge of the semiconductor industry and Micron is preferred

• Ability to apply baseline digital fluency and role appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem solving, operational tasks, and achieving business outcomes.

• Embody Micron's core values:

• People - Respect, develop, and empower others

• Innovation - Drive continuous improvement and breakthrough thinking

• Tenacity - Show grit and determination

• Collaboration - Build trust and foster teamwork

• Customer Focus - Deliver excellence and value