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MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Package Development Engineer

Fresher
SGD 4,800 - 5,500 per month
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  • Posted 21 hours ago
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Job Description

Micron Technology's vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community.

We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing.

The position partners closely with stakeholders such as Development Team & Manufacturing and supplier teams across Micron's global network.

Main Responsibilities

General Responsibilities

  • Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness.

  • Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work.

Responsibilities

  • Apply engineering and statistical methods to accelerate learning cycles from DOE through product qualifications.

  • Partner with APTD and manufacturing teams to support LVM and RAR.

  • Perform risk assessments (FMEA) and implement effective control plans and corrective actions for abnormal conditions.

  • Enable smooth technology transfer from development to highvolume manufacturing.

Candidate Profile / Job Requirements

Minimum Required Qualifications

  • Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline.

  • Operations support, including shift and weekend coverage, is required.

Must Have Technical Skills

  • Applied understanding of theoretical knowledge relevant to wafer fabrication or IC packaging or packaging reliability.

  • Demonstrate strong engineering foundation.

  • Strong analytical, structured problemsolving, and datadriven decisionmaking skills like ANOVA and SPC, etc.

MustHave Soft Skills

  • Effective communication skills to collaborate across global, crossfunctional teams.

  • Use AI -enabled tool responsibly and optimally for research, analysis, content creation, problem-solving, operational task, and achieving business outcome.

Highly Desirable / Preferred Skills

  • Familiarity with MES systems, automation, and data analytics tools (e.g., JMP, Python).

Inclusion & Accessibility Statement

Micron is committed to fair, inclusive, and meritbased hiring. Reasonable accommodation is available to enable individuals with disabilities to perform the essential functions of this role. All qualified candidates are encouraged to apply.

Values Alignment

Successful candidates are expected to embody Micron's core values:

  • People - Respect, develop, and empower others

  • Innovation - Drive continuous improvement and breakthrough thinking

  • Tenacity - Demonstrate accountability and perseverance

  • Collaboration - Build trust and work as one team

  • Customer Focus - Deliver excellence and value

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Job ID: 143956381