Job Description:
Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 112G and higher, RF/Microwave ADC/DAC, DDR and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.
RESPONSIBILITIES:
- Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
- Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, etc.
- Schedule, prioritize, & track your work across multiple projects simultaneously
- General flip-chip BGA package design & engineering
EDUCATION/EXPERIENCE & REQUIREMENTS:
- B.Eng (EE/EEE) or similar field and 5+ years experience in flip-chip-BGA package design, including high-speed SerDes
- M.Eng (EE/EEE) or similar field and 3+ years experience in flip-chip-BGA package design, including high-speed SerDes
- Knowledge of package-level signal integrity and power integrity, to apply to package designs
- Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
- Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers.
- Good organizational and task management skills to manage multiple package design projects.
PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS:
- B.Eng (EE/EEE) or similar field and 8+ years experience in flip-chip-BGA package design, including high-speed SerDes preferred.
- M.Eng (EE/EEE) or similar field and 6+ years experience in flip-chip-BGA package design, including high-speed SerDes preferred.
R026131
