Responsible for set-up and optimization of new device qualification, engineering lot processing, process data gathering and reporting.
Monitor and improve device yield performance and process SPC charts.
Investigate and troubleshoot production downtime and quality issues to provide lot disposition on outlier lots.
Perform engineering report and documentation such as 8D, DMAIC, FMEA, CP, Process Specification, Work Instructions, etc.
Implement continuous improvement program (CIP) to support yield and cost improvement, including developing systems for workflow management
Facilitate training of manufacturing personnel on operating procedures and process specification.
Work closely with inter-department to improve process and equipment performance and capability.
Coordinate and communicate with customers for any process engineering related matters.
Setup systems and NPI requirements, handles qualifications and engineering activities.
Requirements
Diploma / Degree in any Engineering Discipline
Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly processes (Backgrind, Laser Marking, Laser Groove, Wafer Dicing) is an advantage.
Knowledge in SPC, DOE, FMEA, OCAP, Control Plan, WI and Process Specification
Clear and effective communication with customers, suppliers and cross department
Able to multi-task and support ad-hoc projects in process and equipment related activities
