MTS or Principal HIG-HBM Systems Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The role of a High Bandwidth Memory (HBM) System Engineer at Micron Technology, Inc. is pivotal in the introduction of Micron's HBM with our customers. This role will empower customers through the utilization of High Bandwidth Memory (HBM) integrated with ground breaking 2.5D and 3D System in Package (SiP) solutions. This encompasses a comprehensive approach to system level testing, encompassing electrical, software, and system validation perspectives. The incumbent will spearhead the development of innovative test algorithms and plans, which includes the design and execution of robust system test infrastructure capabilities to ensure the highest standards of quality and performance. Your strategic leadership will be crucial in synchronizing efforts across various teams to achieve a seamless and successful product launch with our customers.

Responsibilities:

Provide Technical Leadership and Direction

• Initiate collaborations with customers, Technology Development (TD), Testing, and Manufacturing teams in advance of silicon arrival

• Maintain responsibility for the successful customer launch of the product

• Great communication and presentation skills - ability to present to both internal leadership and customer forums

• Strong interpersonal skills with ability to convey sophisticated technical concepts to peers and customers

• Develop, diagnose, and validate HBM System testing programs and inhouse system solutions

• Assess and determine the necessary equipment and hardware for optimal system validation processes

• Lead the development of High-Performance Computing (HPC) and Artificial Intelligence (AI) software testing strategies to enhance product testing

• Strategically plan projects and manage resource allocation to adhere to established timelines and objectives

• Enhance efficiency, coverage, turnaround time of validation activities

• Provide guidance and ensure alignment with specific company-wide projects

Minimum Qualifications:

• BS or MS in Electrical or Computer Engineering or related field.

• 8+ years (BS) or 10+ years (MS) of relevant experience.

• Deep knowledge of DRAM operation, JEDEC specs, and HBM product family.

• Strong communication skills to convey complex technical concepts.

• Experience with scripting languages (Python, TCL, Perl).

• Proven innovation and problem-solving in high-performance memory development

• Good understanding of computer architecture, memory subsystems, and memory technologies

• Proven team leader - respect, integrity, positive demeanor

Preferred Qualifications:

• Understanding of system architectures and memory subsystems Previous experience validating products with both hardware/firmware/software components

• Experience with bring-up and validation of ASIC/GPU with HBM memory subsystems

• Familiarity with industry-standard memory interfaces and protocols, such as LPDDR, DDR, HBM, GDDR, CXL, UCIe, and PCIe

• Excellent problem-solving and analytical skills

• A self-motivated, enthusiastic team player who enjoys working with others

• Good communication skills with the ability to convey complex technical concepts to other design and verification peers in verbal and written form