Module Process Engineer (Advanced Packaging)

Roles & Responsibilities

• Own process qualification for newly installed tool(s) (e.g., Bonding, Etch, CVD/PVD, CMP, Plating, etc.) to support Nano Space and P4.0 startup.

• Collaborate with APG and factory teams to set up MES/RMS and pre-production line for successful ramp-up.

• Sustain and optimize assigned process modules for internal test vehicle builds supporting heterogeneous integration.

• Monitor tool performance, yield, and defectivity drive corrective actions.

• Partner with Business Units (BU) to enable key customer projects and technology transfers.

• Execute DOE for recipe development and process optimization to improve cost, cycle time, and quality.

• Apply model-based problem solving and root cause analysis for excursions implement preventive measures.

• Work closely with integration, BU, and operations teams to meet startup and ramp objectives.

• Maintain process specifications, FMEA, and train technicians/associates for operational readiness.

Requirements

• PhD/ Master/ Bachelor in Materials Science, Chemical Engineering, Electrical Engineering or related studies

• 3 years and above of process-related experiences in semiconductor industry

• Strong knowledge of semiconductor processes (e.g., Etch, CMP, CVD/PVD, Plating, Bonding, etc).

• Experience in process qualification and startup for advanced packaging or front-end modules.

• Proficiency in DOE, SPC, and data analysis tools.

• Demonstrated ability in conceptual and practical problem solving.

• Strong communication, collaboration, and ability to thrive in a fast-paced startup environment.

Work Location

• Science Park II (Moving to Tampines in end 2026)