What a Dry Etch Process Engineer does in HP include:
- Own and sustain dry etch processes for silicon and oxide etching modules to support high-volume manufacturing and new product introduction (NPI).
- Drive process optimization, defect reduction, yield improvement, and process robustness through data analysis, DOE, and continuous improvement projects.
- Investigate process excursions, yield loss, and defectivity issues using structured problem-solving methodologies, and implement effective corrective and preventive actions.
- Develop and maintain process control plans, SPC monitoring, OCAPs, specifications, and process documentation.
- Collaborate closely with equipment engineers to resolve process-related equipment issues and establish effective process monitoring strategies.
- Lead process characterization, qualification, and release activities for new products, materials, consumables, and process changes.
- Support process transfer, technology development, and process integration activities across engineering and manufacturing teams.
- Analyze process performance data and drive improvements in critical process metrics, including yield, defectivity, process capability, and throughput.
- Work closely with cross-functional teams including Process Integration, Manufacturing, Equipment Engineering, Quality, and Product Development to achieve business objectives.
- Provide technical guidance and training to technicians and manufacturing personnel on process operation, troubleshooting, and best practices.
- Support quality, and compliance audits to ensure process and documentation adherence to internal and external requirements.
Individuals who will do well in the role usually possess:
- Bachelor's or Master's Degree in Chemical Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or related disciplines.
- Minimum 2–5 years of hands-on semiconductor wafer fab experience in dry etch process engineering.
- Strong knowledge of plasma etching fundamentals, particularly silicon etch, oxide etch, and profile control. Experience with process development, process characterization, DOE, SPC, and statistical data analysis.
- Experience supporting high-volume manufacturing with demonstrated success in yield improvement and defect reduction projects.
- Familiarity with semiconductor process integration and interactions between dry etch and upstream/downstream process modules.
- Experience with process troubleshooting using engineering methodologies such as 8D, DMAIC, or root cause analysis techniques.
- Knowledge of process control systems, FDC, APC, SPC, and process monitoring methodologies is advantageous.
- Strong analytical and problem-solving skills with the ability to handle complex technical challenges independently.
- Good communication, presentation, and technical documentation skills. Self-motivated, proactive, and able to work effectively in a fast-paced manufacturing environment.
- Good team player with strong collaboration skills across global and cross-functional teams.
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