Member of Technical Staff, NAND Advanced Thin Films Process Development

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Position Overview

The Member of Technical Staff (MTS) in Process Development for Advanced Thin Film plays a critical role in advancing thin film process development for NAND memory technology. This position is responsible for performing experiments, conducting material characterization, and providing support for process integration and fixing. As a key contributor, the MTS collaborates with senior engineers and Multi-functional teams to promote manufacturability, continuous improvement, and ongoing technology advancement within the organization.

Key Responsibilities

• Lead project-level initiatives focused on the development of structural and electrical film processes, especially dielectric (including Low and High K) and Carbon based films.

• Carry out complex experiments and support process integration under the guidance of senior staff members.

• Use technical expertise to achieve measurable results that benefit the department or site.

• Collaborate with various functions to facilitate technology transfer and assist in process ramp-up activities.

• Maintain accurate and thorough records of experiments and processes, and prepare comprehensive technical reports.

• Mentor staff members early in their careers and provide leadership that aligns with TLP entry expectations.

• Support initiatives aimed at continuous improvement and optimization of existing processes.

• Participate in multi-functional problem-solving teams to address process challenges and drive innovation.

• Contribute to the development and documentation of guidelines, standard operating procedures, and knowledge management systems.

• Know the latest with emerging technologies, industry trends, and advancements in thin film processing and characterization.

Technical Qualifications

• Demonstrated expertise in thin film deposition techniques, such as Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (plasma and thermal), including recipe setup, process tuning, and fixing.

• Proficiency in using metrology tools-including ellipsometry, X-ray reflectivity (XRR), Scanning Electron Microscopy (SEM), and Transmission Electron Microscopy (TEM)-for material characterization and process monitoring.

• Solid understanding of process integration, defect analysis, and methods for yield improvement.

• Familiarity with electrical evaluation methods and Fab metrology tools, such as CD-SEM, thickness measurement instruments, and particle counters.

• Competence in process optimization, documentation, and data analysis, including statistical process control (SPC), design of experiments (DOE), and root cause analysis.

• Experience with fixing process issues, implementing corrective actions, and supporting technology transfer from R&D to manufacturing.

• Ability to communicate technical findings effectively, both verbally and in writing, to diverse audiences.

• Experience with knowledge management systems, SOP development, and compliance with safety and quality standards.

Requirements :

• PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a closely related field.

• 10 to 15 years of experience in Thin Film research and development for NAND process specifically Diffusion and CVD Films.

• Demonstrated experience in multi-functional collaboration and project-level leadership.

• Strong record of technical contributions, publications, or patents in relevant domains (preferred).