Member of Technical Staff, Advanced Packaging Technology Development – Process Integration

Job Summary

The Package Health Technology Lead will lead the strategic direction and execution of package health monitoring initiatives across advanced packaging technologies. This role is responsible for defining the long-term roadmap, establishing cross-functional alignment, and driving innovation in design-for-test (DFT), data science, and AI-driven solutions for package reliability and performance.

Key Responsibilities

• Define and lead the strategic roadmap for package health monitoring and diagnostics.

• Develop new heterogeneous integration and 3DIC flows.

• Develop next-generation interconnects for memory and logic technology.

• Establish cross-functional governance for Design for Test (DFT) for packaging.

• Oversee development and deployment of AI/ML-based predictive health analytics.

• Drive collaboration with design, materials, reliability, and manufacturing teams.

• Sponsor simulation and modeling initiatives for mechanical and electrical integrity.

• Mentor and develop technical leaders across the package health organization.

• Represent package health strategy in executive and customer forums.

Qualifications

• Ph.D. or Master's degree in Electrical Engineering, Materials Science, or related field.

• 25+ years of experience in semiconductor advanced packaging.

• Proven leadership in cross-functional and global engineering environments.

• Proven experience in advanced interconnects, TSVs, TCB, W2W and C2W stacking technologies.

• Strong background in data analytics, simulation, and advanced packaging technologies.

• Proven record [patents, publications] of technology innovation.

Additional/Preferred Qualifications

• Experience with AI/ML platforms for predictive analytics.

• Track record of defining and implementing DFT strategies.

• Publications or patents in packaging reliability or diagnostics.