Responsibilities
- Design, engineer, and optimize mechatronic and motion control systems for semiconductor packaging and assembly equipment.
- Collaborate closely with cross-functional R&D teams (mechanical, electrical, software) across local and global engineering sites.
- Provide 3rd-level technical escalation support to regional manufacturing plants and global customer sites.
- Commission, test, qualify, and document new mechatronic modules and motion control solutions.
- Set up, organize, and maintain laboratory test equipment to support cross-disciplinary testing activities.
- Participate in high-level architectural and conceptual system design initiatives for new equipment platforms.
Requirements
- Bachelor's, Master's, or PhD in Mechatronics, Control Engineering, Electrical Engineering, or a related discipline.
- 3+ years of relevant mechatronics experience preferred, ideally within semiconductor equipment manufacturing.
- Technical mastery in Control Theory, Motion Control, Sensorics, Motors, basic electronics, and Matlab.
- Knowledge of Basic C++ (Object-Oriented Programming), Mechanics/Dynamics, Machine Vision, or ESG project experience would be advantageous.
- Strong communication skills with the capability to operate effectively in an international, multi-cultural setting.
- Willingness to travel occasionally to R&D centers in Europe and manufacturing sites across Asia as required.
Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to [Confidential Information]
EA License No: 13C6305
Reg. No.: R1985234 (GOH HOOI MING)
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