Materials Engineer

You will drive material selection for semiconductor packaging and module assembly, in particular adhesives for mechanical and electrical interconnect purposes. Perform new material characterization and understand material applications and feedback findings or issues encountered during characterization.

Minimum Qualifications

• Degree of Materials/Chemical Engineering
• More than 3 years experience in DMA/TMA/DSC/Rheometer/TGA characterization

Preferred Qualifications

• Experience/knowledge on adhesive material formulation
• Experience on GCMS
• Material level characterization methodology development (how to correlate with module performance)