About This Position
- The jobholder has overall responsibility globally for the Mobile/Telecom/5G cluster market strategy, which includes all types of adhesives, encapsulants and thermal management materials used in the construction of semiconductor packages. The jobholder is responsible for the further development and implementation of the strategy and future direction of the segment.
- The jobholder also takes additional regional role and responsibility to build and guide execution of China regional semiconductor strategy.
What you´ll do
- Be responsible for the overall strategy, innovation portfolio and future direction of the cluster.
- Define and drive semiconductor packaging business plans for the assigned cluster and region with clear timelines and measurable outcomes, including: Defining product promotion strategies and providing the sales team with adequate training and presentation materials, defining clear product requirements, timelines, and pricing plans.
- Provide guidance to the respective teams pertaining to the segment strategy and tactics, target applications and recommended products.
- Collect and analyze peer competitor initiatives across all business areas and their financial performance.
- Ensures consistency in market sizing methodology in the SBU for market models. Develop, track and assess economic indicators to better forecast business. Manage and extract data from in-house and externally sourced market research databases.
- Visit customers, attend industry conferences, and meet with third party partners on a regular basis to maintain market understanding and develop key relationships.
- Collect target cluster Macro trend to develop technology / product roadmaps for exchange and dialogue with sales and customers to capture future growth and sustain market segment growth.
- Provide input to the marketing communications team on the commercialization of new products and segment specific promotional efforts.
- Provide regular reports on the performance of the segment/cluster during leadership meetings, and to senior management as needed.
What makes you a good fit
- BS degree and above in applicable technical or scientific discipline (Electrical Engineering, Chemical Engineering, etc.); MBA preferred.
- Knowledge of semiconductor packaging & assembly processes and material expertise required, especially in advance packaging field.
- Good strategically thinking and strong discipline on prioritized targets.
- Leadership and multicultural skills highly desirable.
- Excellent communication and project management skills.
- Proficient in Microsoft Office.
- 10+ years of experience in semiconductor industry ideally with both engineering and business roles.
- Job based in Shanghai, CN. Singapore and Taiwan candidates are also considered if he/she is OK with frequent travel to China mainland for regional role support needs.
Some perks of joining Henkel
- Flexible work scheme with flexible hours, hybrid work model, and work from anywhere policy for up to 30 days per year
- Diverse national and international growth opportunities
- Global wellbeing standards with health and preventive care programs
- Gender-neutral parental leave for a minimum of 8 weeks
- Employee Share Plan with voluntary investment and Henkel matching shares
- Comprehensive Group Insurance Scheme
- Annual Physical Examination
- Flexible Benefits cover for dependents
- Company Products Discount
At Henkel, we come from a broad range of backgrounds, perspectives, and life experiences. We believe the uniqueness of all our employees is the power in us. Become part of the team and bring your uniqueness to us! We welcome all applications across different genders, origins, cultures, religions, sexual orientations, disabilities, and generations.
