Intern - Process Engineer

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Description:
Micron MSB is seeking a passionate and driven intern to join our Assembly Process Engineering team. This internship offers hands-on exposure to advanced semiconductor packaging processes, with a focus onFlip Chip AttachandUnderfilltechnologies. The ideal candidate will be part of a project to drive process development, yield improvement, and data-driven decision-making. A strong foundation instatisticsandAI programmingis a plus and will be leveraged to enhance process analysis and automation.

Project Scope:
- Setup, execute, and analysis of Flip Chip Attach and Underfill process experiments.
- Collaborate with cross-functional teams to troubleshoot and resolve process issues and work on engineering projects.

- Apply statistical methods to analyze process data and identify trends or anomalies.

- Explore AI-based approaches for predictive modeling and process optimization.

Deliverable:
- A final presentation summarizing key learnings, challenges, and recommendations.
- Contribution to at least one yield improvement or defect reduction initiative.
- Development of a simple AI model or script to support process monitoring or defect prediction

Requirement:
Degree in Mechanical/Chemical/Material Science Engineering with internship availability from January to May 2026