Hyperscale Server Design Engineer

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The Opportunity:

Adecco is partnering with a global leading Electronics Manufacturing Service provider specializing in designing and building complex, high-technology products for OEM. We are searching for a Server Hardware Design Engineer as a pioneer team member to their R&D team in Singapore. This position is responsible for designing, validating, and optimizing high-performance server hardware, racks, and infrastructure systems to support massive-scale cloud computing environments.

The Job:

• Conduct server feasibility studies, define and maintain hardware architectures and solutions, and create execution plan.
• Design schematic, create BOM, support prototype/engineering build.
• Guide and work with PCB engineers on layout and placement.
• Design, deploy, and operate large-scale GPU-based compute environments, including optimizing network topologies like InfiniBand and Ethernet.
• Lead server validation and bringing up complex systems, including lab validation, SI/PI (Signal Integrity/Power Integrity) analysis, and debugging.
• Partner with software, datacenter engineering, mechanical and thermal, and vendor teams to ensure seamless hardware/software integration. Drive root cause analysis and corrective actions.
• Apply advanced knowledge of server energy efficiency and power redundancy to optimize for performance and cost.
• Work with manufacturing teams to resolve issues and to support NPI and production builds.
• Provide technical expertise and consultation to peers.
• Maintain consistent high quality of engineering design work to develop robust, high performance and cost effective designs and products.

The Talent:

• Degree/Master in Electrical/Electronic/Computer Engineering or equivalent
  
• Minimum of 5-10 years of experience in computer architecture, server design or hardware validation.
• Strong design experience and knowledge in any of the following:
• Knowledge of GPU/CPU architectures, high-speed interfaces (QSFP-DD/OSFP) and memory interfaces such as DDRx DRAM, NAND/NOR/SPI Flash.
• High speed interfaces including PCIe, NVLink, GbE, SAS, USB.
• BMC implementations.
• High DC voltage power designs and distribution, and thermal management.
• High-speed Ethernet networking.
• Experience with liquid cooling is an advantage.
• Understanding integration of software and hardware.
• NPI project execution experience and familiarity with Product Development Life Cycle will be desirable.
• Experience using CAD tools (e.g. Cadence Allegro, Mentor PAD).
• Experience with SI/PI simulation (e.g. ANSYS HFSS/SIWave) and lab equipment like high-speed oscilloscopes and VNAs are added advantage.
• Familiar with ISO9001.
• Troubleshooting skills in high-speed signaling, thermal or power delivery.
• Self motivated and willing to learn new technology and skills who works well under pressure.
• Excellent oral and written communication skills.

Next Steps:

• Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
• Apply through this application or send your resume to [Confidential Information] in MS Word Copy. We'd love to hear from you!
• We regret that only shortlisted candidates will be notified.

Loo Hui Yang
Direct Line: 9342 5045
EA License No: 91C2918
Personnel Registration Number: R11011456