Job Responsibilities
- Lead local Hybrid Bonding equipment full-cycle R&D, architecture design, technical breakthrough and iteration.
- Connect with local & Southeast Asian OSAT/wafer fabs, match HBM, Chiplet, 3D stacking process demands, deliver technical solutions.
- Oversee precision mechanism, nano alignment, motion control, vacuum & temp-pressure control, electrical and software system integration & debugging.
- Complete prototype tuning, accuracy optimization, yield improvement and customer acceptance, resolve mass production technical issues.
- Manage local R&D team, formulate R&D standards, coordinate local supply chain to realize localized mass production.
- Track frontier industry technology, carry out technical pre-research and patent layout to boost business commercialization.
Requirements
- Bachelor or above, major in Mechanics, Automation, Microelectronics, Semiconductor Equipment etc.,
- 10+ years semiconductor packaging equipment R&D experience, 5+ years Hybrid Bonder complete machine development & mass production experience.
- Master nano-level alignment, bonding temp-pressure control, vacuum system design, and familiar with advanced packaging processes.
- Experienced in R&D team management, strong project management & cross-team communication skills, able to work under pressure.
How To Apply:
Interested candidate, please submit your updated resume in MS Word format to Terry Ng,
email – [Confidential Information]
EA Personnel Reg. No. R1107654, Achieve Career Consultant Pte Ltd EA License No. 05C3451
Due to the nature of this search, only shortlisted candidates will be contacted with further details about the organization.
