Head of IC Design Team
Achieve Group- Posted 17 hours ago
- Be among the first 10 applicants
Job Description
The Role
You will take over leadership of an existing IC design team in Singapore, with a mandate to build and scale capability as the business expands. This is a hands-on technical leadership role with direct exposure to business-unit strategy and senior leadership.
Key Responsibilities:
- Lead the IC design team through the qualification of the company's self-developed microphone chip for a major global consumer electronics customer, meeting stringent technical and quality requirements
- Build long-term IC design capability across multiple MEMS product lines, including piezoelectric MEMS and inertial MEMS
- Own the team's technical roadmap from design through tape-out and mass production
- Provide technical leadership and people management across a growing design team
- Collaborate closely with global cross-functional partners — MEMS engineering teams (Edinburgh), product integration teams (China), and packaging/test teams — as part of a global chip platform organization
Required:
- 8+ years of digital CMOS IC design experience, with complete tape-out and mass production track record
- Strong end-to-end understanding of the IC design-to-mass-production lifecycle
- Team management or technical leadership experience
- Professional working proficiency in English
Preferred:
- ASIC design experience for MEMS sensor interfaces
- Experience delivering IC projects for major global consumer electronics OEMs, with familiarity with their quality and technical qualification standards
- IC design experience specific to piezoelectric MEMS or inertial MEMS
How To Apply:
Interested candidate, please submit your updated resume in MS WORD Format to Terry Ng, email – [Confidential Information]
EA Personnel Reg. No. R1107654, Achieve Career Consultant Pte Ltd EA Licence No. 05C3451
We regret that only shortlisted candidates will be notified. Thank you for your interest in this opportunity.
More Info
Key Skills
IC design-to-mass-production lifecycle
inertial MEMS
MEMS sensor interfaces
piezoelectric MEMS
tape-out
digital CMOS IC design
