Provide FA support on customer failures by using various FA tools & techniques include non-destructive analysis, EFI (electrical fault isolation) and PFA (physical failure analysis).
Communicate and work closely with cross-functional teams include Product Test Engineering , RMA engineering for failure verification/validation, test set up and/or test characterization.
Perform EFI by using techniques of emission & laser stimulation, which include the Thermal emission, Photon emission, Obirch/TIVA, Dynamic Laser Stimulation and so on.
Perform PFA include both package and silicon die level analysis by using CSAM, X-ray, sample preparation, SEM/EDX, FIB etc.
Correlate the EFI and PFA results electrically by GDS layout and schematic study.
Compile FA images, data into final FA report and communicate with requestors/customers.
Participate in new FA techniques/methodologies/recipes development and tool's evaluation projects.
Job Requirements:
Degree in IC Design. /Electrical Computer/Material Science/Mechanical or equivalent.
FA experience in the semiconductor industry will be preferred.
Advantage if familiar with semiconductor fabrication, Test, Assembly & Packaging process.
Fast for learning and able to perform independent work.
