Purpose of the Job
- To lead the equipment engineering team in managing the entire infrastructure for Bump, RDL, CoW, and MEOL, driving long-term operational excellence and aligning equipment capabilities with next-generation packaging roadmaps.
Key Job Accountabilities:
- Oversee the structural integrity of Under Bump Metallization (UBM) and Sputtering/PVD processes to ensure electrical connectivity and mechanical adhesion.
- Strategic planning for equipment upgrades and modifications to meet the precision requirements for 2.5D/3D and Chiplet packaging.
- Lead technical negotiations and manage relationships with global equipment suppliers (e.g., AMAT, ASML, TEL, Besi, EVG) for new capacity expansion.
- Accountable for departmental performance metrics including MTBF (Mean Time Between Failures), MTTR (Mean Time To Repair), and Maintenance Cost.
- Mentor engineers to build full-stack expertise across multiple process stages and manage performance evaluations.
Required Experience and Qualifications:
- Bachelor's degree in Electrical, Electronic, Mechanical Engineering, or a related field
- 10+ years in Semiconductor Equipment Engineering, with specialized experience in Advanced Packaging (WLP, Flip-Chip, or SiP).
- Deep knowledge of high-precision bonding (CoW), thin-wafer handling, and RDL process-tool interactions.
- Proven ability to manage CapEx projects from tool selection to Final Acceptance Test (FAT).
- Strong leadership, negotiation, and cross-functional communication skills in a global corporate environment.
